Layers:
• Unclad, single sided
• Double sided
• Multi-layerd up to 18 layers
• Flexible / Rigid-flex
Materials:
• BT
• FR-4
• FR-5
• CEM series
• Polyimide
• Metal core and thermal clad
• Getek
• Roger’s
• Thermagon (T-preg)
• Aluminium substrate
• Ask about special combinations
Solder Masks:
• Liquid photo imageable
• Thermal cure -SR1000, SR1010, SR1020
• Different colors available
Finishes:
• SMOBC
• Hot air solder level
• Nickel/Gold, full selective
• Carbon Ink
• Immersion tin
• Peelable mask
Specifications:
• UL approved, 94V-0
• Standard commercial IPC-A-600
• Special specification requests
Special Technologies:
• Electroless silver and gold
• 3 Mil Line / 3 Mil space
• 12 Mil pitch thin multilayered up to 0.015″
• Small holes to 0.008″
• Surface mount and through hole
• BGA, PCMCIA bright tin/lead process
• Blind/buried vias
• Controlled impedance / dielectric
• Heat sinks
• Carbon ink, epoxy filled
